IEC 60068-2-20:2021
Environmental testing - Part 2-20: Tests - Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
- Standard No.
- IEC 60068-2-20:2021
- Release Date
- 2021
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60068-2-20:2021
- Replace By
- IEC 60068-2-20:2008 IEC 91/1701/FDIS:2021
- Scope
- This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068258. This document provides procedures for determining the solderability and resistance to solderin
IEC 60068-2-20:2021 history
- 0000 IEC 60068-2-20:2021 RLV
- 2008 IEC 60068-2-20:2008 Environmental testing - Part 2: Tests - Test T: Test methods for soldeability and resistance to soldering heat of devices with leads
- 1970 IEC 60068-2-20:1979/AMD2:1987 Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering
- 1970 IEC 60068-2-20:1979/AMD1:1986 Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering
- 1979 IEC 60068-2-20:1979 Environmental testing. Part 2: Tests. Test T: Soldering
- 1970 IEC 60068-2-20:1968 Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
- 1970 IEC 60068-2-20:1960 Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering
