- Standard No.
- SJ/T 10754-2015
- Language
- Chinese, Available in English version
- Release Date
- 2015
- Published By
- Professional Standard - Electron
- Latest
-
SJ/T 10754-2015
- Replace
-
SJ/T 10754-1996
SJ/T 10755-1996
- Scope
- This standard specifies methods for determining the cleanliness and splatter properties of gold, silver and their alloy solders for electronic devices.
SJ/T 10754-2015 Referenced Document
- GB/T 1467 Method for chemical analysis of metallurgy product.General rules and regulations
- GB/T 20001.1 Standards Drafting Rules Part 1: Terminology*， 2024-03-15 Update
- GB/T 20001.10 Rules for drafting standards.Part 10:Product standards
- GB/T 20001.11 Rules for drafting standards—Part 11:Management system standards*， 2022-10-14 Update
- GB/T 20001.2 Rules for drafting standards—Part 2: Symbol standards
- GB/T 20001.3 Rules for drafting standards.Part 3: Classification standards
- GB/T 20001.4 Rules for drafting standards.Part 4:Test method standards
- GB/T 20001.5 Rules for drafting standards.Part 5:Specification standards*， 2017-12-29 Update
- GB/T 20001.6 Rules for drafting standards—Part 6: Code of practice standards*， 2017-12-29 Update
- GB/T 20001.7 Rules for drafting standards.Part 7:Guide standards*， 2017-12-29 Update
SJ/T 10754-2015 history
- 2015 SJ/T 10754-2015 Test methods for gold, silver and their alloy brazing for electron device Determination of cleanness, spatter
- 1970 SJ/T 10754-1996 Test methods for gold, silver and their alloy brazing for electronic devices - Test method for cleanness
SJ/T 10754-2015 Test methods for gold, silver and their alloy brazing for electron device Determination of cleanness, spatter has been changed from SJ/T 10755-1996 Test methods for gold, silver and their alloy brazing for electronic devices - Test method for spatter property.