EN IEC 61190-1-3:2018
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Standard No.

EN IEC 61190-1-3:2018

Release Date

2018

Published By

European Committee for Electrotechnical Standardization（CENELEC）

Latest

EN IEC 61190-1-3:2018

EN IEC 61190-1-3:2018 history

• 2018 EN IEC 61190-1-3:2018 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications