IEC 61189-2-721:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad lamin
- Standard No.
- IEC 61189-2-721:2015
- Release Date
- 2015
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 61189-2-721:2015
- Replace
- IEC 91/1246/FDIS:2015
- Scope
- This part of IEC 61189 outlines a way to determine the relative permittivity ( ??) and loss tangent (tan??) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1@1 GHz to 20 GHz) using a split post dielectric resonator (SPDR). This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.
IEC 61189-2-721:2015 history
- 2015 IEC 61189-2-721:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad lamin
