IEC 61340-4-1:2003/AMD1:2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad lamin

Standard No.

IEC 61340-4-1:2003/AMD1:2015

Release Date

2015

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 61340-4-1:2003/AMD1:2015

Replace

IEC 101/461/FDIS:2015

IEC 61340-4-1:2003/AMD1:2015 history

• 2015 IEC 61340-4-1:2003/AMD1:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad lamin
• 2015 IEC 61340-4-1:2015 Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors
• 2003 IEC 61340-4-1:2003 Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors
• 1995 IEC 61340-4-1:1995 Electrostatics - Part 4: Standard Test Methods for Specific Applications - Section 1: Electrostatic Behaviour of Floor Coverings and Installed Floors (Edition 1.0)