GB/T 31476-2015
Requirements for solders for high-quality interconnections in electronics assembly (English Version)

Standard No.

GB/T 31476-2015

Language

Chinese, Available in English version

Release Date

2015

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Latest

GB/T 31476-2015

Scope

This standard specifies the classification, technical requirements, test methods, inspection rules and marking, packaging, transportation and storage of solders for high-quality internal interconnection of electronic assemblies. This standard applies to solders used for soldering connections in the assembly of electronic products, including leaded solders, lead-free solders and special solders.

GB/T 31476-2015 Referenced Document

• GB/T 31474 Soldering fluxes for high-quality interconnections in electronics assembly
• GB/T 31475 Requirements for solder paste for high-quality interconnections in electronics assembly
• GB/T 3260.1 Methods for chemical analysis of tin.Part 1:Determination of copper content.Flame atomic absorption spectrometric method
• GB/T 3260.10 Methods for chemical analysis of tin.Part 10:Determination of cadmium content.Flame atomic absorption spectrometric method
• GB/T 3260.11 Methods for chemical analysis of tin - Part 11: Determination of copper, iron, bismuth, lead, antimony, arsenic, aluminum, zinc, cadmium, silver, nickel and cobalt content by inductively coupled plasma atomic emission spectrometry*， 2023-11-27 Update
• GB/T 3260.2 Methods for chemical analysis of tin.Part 2:Determination of iron content.1,10-phenanthroline photometric method
• GB/T 3260.3 Methods for chemical analysis of tin.Part 3:Determination of bismuth content.KI photometric method and flame atomic absorption spectrometric method
• GB/T 3260.4 Methods for chemical analysis of tin.Part 4:Determination of lead content.Flame atomic absorption spectrometric method
• GB/T 3260.5 Methods for chemical analysis of tin.Part 5:Determination of antimony content.The malachite green photometric method
• GB/T 3260.6 Methods for chemical analysis of tin.Part 6:Determination of arsenic contents.Malachite green arsenic molybdenum heteropoly acid photometric method
• GB/T 3260.7 Methods for chemical analysis of tin.Part7:Determination of aluminium content.Electrothermal atomic absorption spectrometric method
• GB/T 3260.8 Methods for chemical analysis of tin.Part 8:Determination of zinc content.Flame atomic absorption spectrometric method
• GB/T 3260.9 Methods for chemical analysis of tin.Part 9:Determination of sulphur content.Infra-red absorption method after high frequency induction furnace combustion
• ISO 9453 Soft solder alloys — Chemical compositions and forms*， 2020-09-24 Update
• SJ/T 11390 Lead-free solder test methods*， 2019-12-24 Update

GB/T 31476-2015 history

• 2015 GB/T 31476-2015 Requirements for solders for high-quality interconnections in electronics assembly