GB/T 14664-1993
Dimensional tolerances stipulation of plastic packaging mould (English Version)
- Standard No.
- GB/T 14664-1993
- Language
- Chinese, Available in English version
- Release Date
- 1993
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2007-09
- Replace By
- GB/T 14663-2007
- Latest
- GB/T 14663-2007
- Scope
- This specification specifies the dimensional tolerance definitions, tolerance limits and testing methods that directly affect product quality in plastic packaging molds. This standard applies to plastic packaging molds for integrated circuits, semiconductor discrete devices and components, etc. that are packaged in plastic. The packaging material is thermosetting plastic, such as modified epoxy resin, silicone plastic, etc.
GB/T 14664-1993 history
- 2007 GB/T 14663-2007 Specification of plastic packaging moulds
- 1993 GB/T 14664-1993 Dimensional tolerances stipulation of plastic packaging mould
GB/T 14664-1993 Dimensional tolerances stipulation of plastic packaging mould was changed to GB/T 14663-2007 Specification of plastic packaging moulds.
