GB/T 14663-1993
Specification of plastic packaging mould (English Version)
- Standard No.
- GB/T 14663-1993
- Language
- Chinese, Available in English version
- Release Date
- 1993
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Status
- 2007-09
- Replace By
- GB/T 14663-2007
- Latest
- GB/T 14663-2007
- Scope
- This standard stipulates the basic performance, assembly technical conditions, testing and acceptance regulations, packaging, transportation, storage, etc. of plastic sealing molds. This standard applies to plastic packaging molds for integrated circuits, semiconductor discrete devices, components, etc. The packaging material is thermosetting plastic, such as modified epoxy resin, silicone plastic, etc.
GB/T 14663-1993 history
- 2007 GB/T 14663-2007 Specification of plastic packaging moulds
- 1993 GB/T 14663-1993 Specification of plastic packaging mould
