GB/T 14112-1993
Semiconductor integrated circuits Specification for stamped leadframes of plastic DIP (English Version)

Standard No.

GB/T 14112-1993

Language

Chinese, Available in English version

Release Date

1993

Published By

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China

Status

Be replaced 2016-01

Replace By

GB/T 14112-2015

Latest

GB/T 14112-2015

Replace

SEMI G9-1986 SEMI G10-86

Scope

This specification specifies the technical requirements and inspection rules for stamped lead frames (hereinafter referred to as lead frames) for plastic double-row packaging of semiconductor integrated circuits. This specification applies to double-row (DIP) punched lead frames, and single-row punched lead frames can also be used as a reference.

GB/T 14112-1993 history

• 2015 GB/T 14112-2015 Semiconductor integrated circuits.Specification for stamped leadframes of plastic DIP
• 1993 GB/T 14112-1993 Semiconductor integrated circuits Specification for stamped leadframes of plastic DIP