EN ISO 9455-5:2014
Soft soldering fluxes - Test methods - Part 5: Copper mirror test

Standard No.

EN ISO 9455-5:2014

Release Date

2014

Published By

European Committee for Standardization (CEN)

Status

Be replaced 2021-01

Replace By

EN ISO 9455-5:2020

Latest

EN ISO 9455-5:2020

Replace

FprEN ISO 9455-5:2014

Scope

This part of ISO 9455 specifies a qualitative method for assessing flux reactivity to copper. The test is applicable to all class 1 fluxes according to ISO 9454-1.

EN ISO 9455-5:2014 Referenced Document

• ISO 9454-1:1990 Soft soldering fluxes; classification and requirements; part 1: classification, labelling and packaging
• ISO 9455-1:1990 Soft soldering fluxes; test methods; part 1: determination of non-volatile matter, gravimetric method
• ISO 9455-2:1993 Soft soldering fluxes; test methods; part 2: determination of non-volatile matter, ebulliometric method

EN ISO 9455-5:2014 history

• 2020 EN ISO 9455-5:2020 Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2020)
• 2014 EN ISO 9455-5:2014 Soft soldering fluxes - Test methods - Part 5: Copper mirror test

EN ISO 9455-5:2014 Soft soldering fluxes - Test methods - Part 5: Copper mirror test has been changed from EN 29455-5:1993 Soft Soldering Fluxes - Test Methods - Part 5: Copper Mirror Test (ISO 9455-5 : 1992).