JIS C 5630-18:2014
Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials

Standard No.

JIS C 5630-18:2014

Release Date

2014

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS C 5630-18:2014

JIS C 5630-18:2014 Referenced Document

• JIS C 5630-6 Semiconductor devices -- Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials

JIS C 5630-18:2014 history

• 2014 JIS C 5630-18:2014 Semiconductor devices -- Micro-electromechanical devices -- Part 18: Bend testing methods of thin film materials