KS D 0259-2012
Methods of measurement of thickness,thickness variation and bow for silicon wafer

Standard No.

KS D 0259-2012

Release Date

2012

Published By

Korean Agency for Technology and Standards (KATS)

Status

Be replaced

Replace By

KS D 0259-2012(2017)

Latest

KS D 0259-2022

Replace

KS D 0259-2007

Scope

This standard measures the thickness, thickness change, and warpage of silicon single crystal wafers (hereinafter referred to as wafers).

KS D 0259-2012 history

• 2022 KS D 0259-2022 Methods of measurement of thickness,thickness variation and bow for silicon wafer
• 0000 KS D 0259-2012(2017)
• 2012 KS D 0259-2012 Methods of measurement of thickness,thickness variation and bow for silicon wafer
• 0000 KS D 0259-2007