KS C IEC PAS 62170:2003
Bond wire modeling standard

Standard No.

KS C IEC PAS 62170:2003

Release Date

2003

Published By

Korean Agency for Technology and Standards (KATS)

Status

Withdraw

Replace By

KS C IEC PAS 62170-2003(2008)

Latest

KS C IEC PAS 62170-2003(2008)

Scope

This specification covers ball or wedge wires from integrated circuit (IC) dies.

KS C IEC PAS 62170:2003 history

• 0000 KS C IEC PAS 62170-2003(2008)
• 2003 KS C IEC PAS 62170:2003 Bond wire modeling standard