BS PD IEC/TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

Standard No.
BS PD IEC/TR 62866:2014
Release Date
2014
Published By
British Standards Institution (BSI)
Latest
BS PD IEC/TR 62866:2014

BS PD IEC/TR 62866:2014 Referenced Document

  • ANSI/ASQ Z1.4 Sampling Procedures and Tables for Inspection by Attributes
  • ANSI/ASQ Z1.9 Sampling procedures and tables for inspection by variables for percent nonconforming
  • IEC 60068-1 Environmental testing - Part 1: General and guidance
  • IEC 60068-2-2 Environmental testing - Part 2-2: Tests - Test B: Dry heat
  • IEC 60068-3-5 Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers*2018-01-23 Update
  • IEC 60068-3-6 Environmental testing - Part 3-6: Supporting documentation and guidance - Confirmation of the performance of temperature/ humidity chambers*2018-01-23 Update
  • IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*2015-04-01 Update
  • IEC 60749-4 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)*2017-03-01 Update
  • ISO 4677-1 Atmospheres for conditioning and testing; Determination of relative humidity; Part 1 : Aspirated psychrometer method
  • ISO 9455 Soft soldering fluxes — Test methods — Part 9: Determination of ammonia content*2020-10-19 Update
  • MIL-S 

BS PD IEC/TR 62866:2014 history

  • 2014 BS PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing



Copyright ©2023 All Rights Reserved