KS C IEC 61249-4-5:2008
Materials for printed boards and other interconnecting structures-Part 4-5:Sectional specification set for prepreg materials, unclad-Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Standard No.

KS C IEC 61249-4-5:2008

Release Date

2008

Published By

Korean Agency for Technology and Standards (KATS)

Status

Withdraw

Replace By

KS C IEC 61249-4-5:2013

Latest

KS C IEC 61249-4-5:2013

Scope

Among KS C IEC 61249, this standard is for manufacturing multilayer circuit boards in accordance with IEC 62326-4.

KS C IEC 61249-4-5:2008 history

• 2013 KS C IEC 61249-4-5:2013 Materials for printed boards and other interconnecting structures－Part 4－5：Sectional specification set for prepreg materials, unclad－Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
• 2008 KS C IEC 61249-4-5:2008 Materials for printed boards and other interconnecting structures-Part 4-5:Sectional specification set for prepreg materials, unclad-Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability