GB/T 29845-2013 (English Version) PDF

Standard No.: GB/T 29845-2013
Language: Chinese, Available in English version
Release Date: 2013
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 29845-2013

Scope: This standard gives guidelines for specific activities such as final assembly (final assembly), packaging, shipping, and unpacking and placement of semiconductor manufacturing equipment (SME) at the supplier's facility at the supplier's facility, as well as unpacking and placement in the customer's cleanroom production area. This standard applies to final assembly (final assembly), packaging, and shipment of semiconductor manufacturing equipment, individual assemblies and components at supplier plants, and cleanroom production areas from customer loading docks/receiving areas to cleanroom production areas for high-purity and ultra-high-purity applications. transfer process. This standard does not contain special requirements related to the environment, health and safety (EHS), nor does it apply to processing specifications related to wafer particles or wafer quality (such as ionic contamination).

GB/T 29845-2013 Referenced Document

GB/T 25915.1 Cleanrooms and associated controlled environments—Part 1: Classification of air cleanliness by particle concentration*， 2021-08-20 Update

2013 GB/T 29845-2013 Guide for final assembly, packaging, transportation, unpacking, and relocation of semiconductor manufacturing equipment