ANSI/ESD SP5.2.1-2012
Machine Model (MM) Alternative Test Method: Supply Pin Ganging - Component Level
- Standard No.
- ANSI/ESD SP5.2.1-2012
- Release Date
- 2013
- Published By
- Electrostatic Discharge Association (ESDA)
- Status
- Replace By
- ANSI/ESD SP5.2.1-2013
- Latest
- ANSI/ESD SP5.2.1-2013
- Scope
- For those high pin count components (e.g., ball grid array) that interconnect different power leads through common, low-resistance power and ground planes in the package, the number of power and ground leads can be reduced by ganging or grouping supply pins together on a custom test fixture board. A minimum number of power supply pins (i.e., power or ground) should be ganged to bring the total number of tester channels used equal to the number of tester channels available on the tester. NOTE: ANSI/ESD SP5.2.1 does not cover the testing of the signal pins of high pin count devices. It is recommended to use ANSI/ESD SP5.2.2.
ANSI/ESD SP5.2.1-2012 history
- 2013 ANSI/ESD SP5.2.1-2013 ESD Association Standard Practice for Electrostatic Discharge Sensitivity Testing -Machine Model (MM) Alternative Test Method: Supply Pin Ganging - Component Level
- 2013 ANSI/ESD SP5.2.1-2012 Machine Model (MM) Alternative Test Method: Supply Pin Ganging - Component Level
