IEC 62483:2013 PDF

Scope: This International Standard describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements@ (i.e. military@ aerospace@ etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This International Standard does not apply to semiconductor devices with bottom-only terminations where the full plated surface is wetted during assembly (for example: quad-flat no-leads and ball grid array components@ flip chip bump terminations). Adherence to this standard includes meeting the reporting requirements described in Clause 6.

IEC 62483:2013 history

2013 IEC 62483:2013 Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices