IEC 61189-11:2013 PDF

Scope: This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

IEC 61189-11:2013 Referenced Document

IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
IEC 61189-3 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 61190-1-3 Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications*， 2017-12-13 Update
ISO 11357-1 Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles*， 2023-02-17 Update
ISO 9453 Soft solder alloys — Chemical compositions and forms*， 2020-09-24 Update

2013 IEC 61189-11:2013 Test methods for electrical materials, printed boards and other interconnection structures and assemblies.Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys