IEC 60191-6-22:2012
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico

Standard No.

IEC 60191-6-22:2012

Release Date

2012

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60191-6-22:2012

Replace

IEC 47D/812/CDV:2011

Scope

This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

IEC 60191-6-22:2012 history

• 2012 IEC 60191-6-22:2012 Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico