LST EN 60191-6-4-2003
Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003)

Standard No.

LST EN 60191-6-4-2003

Release Date

2003

Published By

Lithuanian Standards Office

Latest

LST EN 60191-6-4-2003

LST EN 60191-6-4-2003 history

• 2003 LST EN 60191-6-4-2003 Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003)