DS/EN 62047-9:2011
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Standard No.

DS/EN 62047-9:2011

Release Date

2011

Published By

Danish Standards Foundation

Latest

DS/EN 62047-9:2011

Scope

This standard describes bonding strength measurement method of wafer to wafer bonding, type of bonding process such as silicon to silicon fusion bonding, silicon to glass anodic bonding, etc., and applicable structure size during MEMS processing/assembly. The applicable wafer thickness is in the range of 10 ìm to several millimeters.

DS/EN 62047-9:2011 history

• 2011 DS/EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS