DS/EN 60749-3/Corr.1:2004
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Standard No.

DS/EN 60749-3/Corr.1:2004

Release Date

2004

Published By

Danish Standards Foundation

Latest

DS/EN 60749-3/Corr.1:2004

Scope

The purpose of this part of IEC 60749 is to verify that the materials, design, construction,markings, and workmanship of a semiconductor device are in accordance with the applicable porcurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance, or both.

DS/EN 60749-3/Corr.1:2004 history

• 2004 DS/EN 60749-3/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
• 2003 DS/EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination