This part of IEC 60455 relates to resin based reactive compounds and their components used for electrical insulation. All reactive compounds are solvent-free and may contain reactive dilutants and fillers. The reactions involved in curing are polymerization and or/crosslinking. This standard does not relate to reactive compounds used as coating powders.
DS/EN 60455-1:1999 history
1999DS/EN 60455-1:1999 Resin based reactive compounds used for electrical insulation - Part 1: Definitions and general requirements
1981DS/IEC 455-1:1981 Specification for solventless polymerisable resinous compounds used for electrical insulation. Part 1: Definitions and general requirements