DS/EN 60191-6-5:2002
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Standard No.

DS/EN 60191-6-5:2002

Release Date

2002

Published By

Danish Standards Foundation

Latest

DS/EN 60191-6-5:2002

Scope

This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

DS/EN 60191-6-5:2002 history

• 2002 DS/EN 60191-6-5:2002 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)