DS/EN 60191-6-2/Corr.1:2003
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Standard No.

DS/EN 60191-6-2/Corr.1:2003

Release Date

2003

Published By

Danish Standards Foundation

Latest

DS/EN 60191-6-2/Corr.1:2003

Scope

This part of IEC 60191 covers the requirements for the preparation of drawings of intergrated circuit outlines for the various ball terminal packages, i.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, i.g. ceramic column grid array (C-CGA).

DS/EN 60191-6-2/Corr.1:2003 history

• 2003 DS/EN 60191-6-2/Corr.1:2003 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
• 2002 DS/EN 60191-6-2:2002 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages