DS/EN 60068-2-20:2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Standard No.

DS/EN 60068-2-20:2008

Release Date

2008

Published By

Danish Standards Foundation

Latest

DS/EN 60068-2-20:2008

Replace

DS/IEC 68-2-20-1989

Scope

This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58.This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3. In addition, test methods are provided to

DS/EN 60068-2-20:2008 history

• 2008 DS/EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
• 1989 DS/IEC 68-2-20:1989 Basic environmental testing procedure. Part 2: Tests. Test T: Soldering