This part of 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), 60068-2-69 should be applied if it is suitable.This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
DS/EN 60068-2-54:2006 history
2006DS/EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
1986DS/IEC 68-2-54:1986 Basic environmental testing procedures. Part 2: Tests. Test Ta: Soldering. Solderability testing by the wetting balance method