DIN EN 62137-3:2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
- Standard No.
- DIN EN 62137-3:2012
- Release Date
- 2012
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 62137-3:2012-08
- Latest
- DIN EN 62137-3:2012-08
- Replace
- DIN IEC 62137-3:2009
DIN EN 62137-3:2012 Referenced Document
- IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
- IEC 61188-5 Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
- IEC 61249-2-7 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad; Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
DIN EN 62137-3:2012 history
- 2012 DIN EN 62137-3:2012-08 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
- 2012 DIN EN 62137-3:2012 Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
- 0000 DIN IEC 62137-3:2009
