IEC 62047-14:2012
Semiconductor devices - Microelectromechanical devices - Part 14: Forming limit measuring method of metallic film materials

Standard No.
IEC 62047-14:2012
Release Date
2012
Published By
International Electrotechnical Commission (IEC)
Latest
IEC 62047-14:2012
Replace
IEC 47F/108/FDIS:2011
Scope
This part of IEC 62047 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0@5 ?? to 300 ??. The metallic film materials described herein are typically used in electric components@ MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting@ it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction@ the effectiveness of manufacturing MEMS components by a forming process can also be improved@ because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.

IEC 62047-14:2012 history

  • 2012 IEC 62047-14:2012 Semiconductor devices - Microelectromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Semiconductor devices - Microelectromechanical devices - Part 14: Forming limit measuring method of metallic film materials



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