GB/T 28162.3-2011
Packaging of components for automatic handing.Part 3:Packaging of surface mount components on continuous tapes (English Version)
- Standard No.
- GB/T 28162.3-2011
- Language
- Chinese, Available in English version
- Release Date
- 2011
- Published By
- General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
- Latest
- GB/T 28162.3-2011
- Scope
- This part of GB/T 28162 applies to tape packaging of electronic components without leads or with lead posts connected to circuits. This section only includes tape sizes that are critical for component tape packaging. This part also includes requirements for the packaging of single-chip products, including bare chips and bumped chips (flip chips).
GB/T 28162.3-2011 Referenced Document
- IEC 60191-2:1966 Mechanical standardization of semiconductor devices. Part 2 : Dimensions
- IEC 61340-5-2:1999 Electrostatique - Partie 5-2: Protection Des Dispositifs Electroniques Contre Les Phenomenes Electrostatiques - Guide D?Utilisation (Edition 1.0)
- ISO 11469:2000 Plastics - Generic identification and marking of plastics products
- ISO/IEC 16388:1999 Information technology - Automatic identification and data capture techniques - Bar code symbology specifications - Code 39
GB/T 28162.3-2011 history
- 2011 GB/T 28162.3-2011 Packaging of components for automatic handing.Part 3:Packaging of surface mount components on continuous tapes
