IEC 60191-6-17:2011
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land gr

Standard No.

IEC 60191-6-17:2011

Release Date

2011

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 60191-6-17:2011

Scope

This part of IEC 60191 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

IEC 60191-6-17:2011 history

• 2011 IEC 60191-6-17:2011 Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land gr