DIN EN 60191-6-21:2011
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6
- Standard No.
- DIN EN 60191-6-21:2011
- Release Date
- 2011
- Published By
- German Institute for Standardization
- Status
- Replace By
- DIN EN 60191-6-21:2011-03
- Latest
- DIN EN 60191-6-21:2011-03
DIN EN 60191-6-21:2011 history
- 2011 DIN EN 60191-6-21:2011-03 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 6019...
- 2011 DIN EN 60191-6-21:2011 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6
DIN EN 60191-6-21:2011 -All Parts
DIN EN 60191-1 E:2017-05 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
DIN EN 60191-3 Beiblatt 1:2006-08 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Supplement 1: Extract of the terms
DIN EN 60191-3:2000-07 Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits (IEC 60191-3:1999); German version EN 60191-3:1999
DIN EN 60191-4 A1 E:2017-04
DIN EN 60191-4:2019-02 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018 / Note: DIN EN 60191-...
DIN EN 60191-6:2010-06 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009 / Note: DIN EN 60191-6 (2005-04) rem...