BS EN 62418:2010
Semiconductor devices. Metallization stress void test
- Standard No.
- BS EN 62418:2010
- Release Date
- 2010
- Published By
- British Standards Institution (BSI)
- Latest
- BS EN 62418:2010
- Scope
- This International Standard describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization. This standard is applicable for reliability investigation and qualification of semiconductor process.
BS EN 62418:2010 history
- 2010 BS EN 62418:2010 Semiconductor devices. Metallization stress void test
