IEC 60191-6-21:2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
- Standard No.
- IEC 60191-6-21:2010
- Release Date
- 2010
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60191-6-21:2010
- Scope
- This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
IEC 60191-6-21:2010 history
- 2010 IEC 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
