BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended
variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or
larger.
BS EN 60191-6-18:2010 history
2010BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)