BS EN 60191-6-18:2010
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

Standard No.
BS EN 60191-6-18:2010
Release Date
2010
Published By
British Standards Institution (BSI)
Latest
BS EN 60191-6-18:2010
Scope
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

BS EN 60191-6-18:2010 history

  • 2010 BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)



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