IEC 62418:2010
Semiconductor devices - Metallization stress void test

Standard No.

IEC 62418:2010

Release Date

2010

Published By

International Electrotechnical Commission (IEC)

Latest

IEC 62418:2010

Scope

This International Standard describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization. This standard is applicable for reliability investigation and qualification of semiconductor process.

IEC 62418:2010 history

• 2010 IEC 62418:2010 Semiconductor devices - Metallization stress void test