IEC 60191-6-18:2010/COR2:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- Standard No.
- IEC 60191-6-18:2010/COR2:2010
- Release Date
- 2010
- Published By
- International Electrotechnical Commission (IEC)
- Latest
- IEC 60191-6-18:2010/COR2:2010
IEC 60191-6-18:2010/COR2:2010 history
- 2010 IEC 60191-6-18:2010/COR2:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- 2010 IEC 60191-6-18:2010/COR1:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
- 2010 IEC 60191-6-18:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
