This specification covers the engineering requirements for electroless deposition of a nickel-thallium-boron or nickel-boron coating on various substrates and properties of the deposit. This process has been used typically to provide hard, ductile, wear-resistant surface for operation in service up to 1000 degrees F (538 degrees C), to provide uniform build up on complex shapes, and to enhance solderability of surfaces, but usage is not limited to such applications. This process is not generally recommended for materials subject to overtempering or high temperature embrittlement when exposed to the post-plating heat treatment of 675 °F (357 °C) for 90 minutes.
SAE AMS2433C-2004 Referenced Document
ASTM B117-03 Standard Practice for Operating Salt Spray (Fog) Apparatus
ASTM B567-98 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method
ASTM B568-98 Standard Test Method for Measurement of Coating Thickness by X-Ray Spectrometry
ASTM E1097-03 Standard Guide for Direct Current Plasma Emission Spectrometry Analysis
ASTM E376-03 Standard Practice for Measuring Coating Thickness by Magnetic-Field or Eddy-Current (Electromagnetic) Examination Methods
SAE AMS4751 Solder@ Tin - Lead@ Eutectic 63Sn - 37Pb
SAE AMS2433C-2004 history
2020SAE AMS2433D-2020 Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
2011SAE AMS2433C-2011 Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
2004SAE AMS2433C-2004 Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
1994SAE AMS2433B-1994 (R) Plating, Nickel-Thallium-Boron or Nickel-Boron Electroless Deposition
1989SAE AMS2433A-1989 ELECTROLESS NICKEL-THALLIUM-BORON OR NICKEL-BORON PLATING