GB/T 13387-2009 (English Version) PDF

Standard No.: GB/T 13387-2009
Language: Chinese, Available in English version
Release Date: 2009
Published By: General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China
Latest: GB/T 13387-2009
Replace: GB/T 13387-1992

Scope: This standard covers the determination of the length of the flat portion of the edge of the wafer. This standard applies to electrical materials whose nominal length of the straight part of the edge of the circular wafer is less than or equal to 65mm. This standard only confirms the accuracy of silicon wafers, and the expected accuracy does not change due to materials. This standard applies to referee measurements and may also be used for routine acceptance measurements when specified limits require greater accuracy than can be obtained by ruler and visual inspection. This standard does not deal with safety issues, even if it is related to the use of the standard. It is the responsibility of the standard user to establish appropriate safety and security measures and to determine the scope of application of regulations.

GB/T 13387-2009 Referenced Document

GB/T 14264-2009 Semiconductor materials-Terms and definitions
GB/T 2828.1-2003 Sampling procedures for inspection by attributes--Part 1: Sampling schemes indexed by acceptance quality limit(AQL) for lot-by-lot inspection

2009 GB/T 13387-2009 Test method for measuring flat length wafers of silicon and other electronic materials
1992 GB/T 13387-1992 Test method for measuring flat length on slices of electronic materials