This standard specifies the method for testing the integrity of silicon crystals by preferential etching techniques. This standard applies to primary defects in silicon single crystal ingots or wafers with crystal orientation <111>, <100> or <110>, resistivity 10Ω•m~10Ω•m, and dislocation density between 0cm~10cm inspection. This method is also applicable to silicon single wafers.
GB/T 1554-2009 Referenced Document
GB/T 14262-1993 Methods for sampling and sample preparation of flotation lead concentrates in bulk
YS/T 209-1994 In-situ defect map of silicon materials
GB/T 1554-2009 history
2009GB/T 1554-2009 Testing method for crystallographic perfection of silicon by preferential etch techniques
1995GB/T 1554-1995 Test method for crystallographic perfection of silicon by preferential etch techniques