HD 323.2.58 S1-1992 Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
European Committee for Electrotechnical Standardization(CENELEC)
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HD 323.2.58 S1-1992
HD 323.2.58 S1-1992 history
1992HD 323.2.58 S1-1992 Environmental Testing - Part 2: Tests Test Td: Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
1991HD 323.2.58 S1-1991 Basic environmental testing procedures; part 2: tests; test Td: solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 68-2-58:1989)