This International Standard specifies the requirements for chemical composition for the following families of soft solder alloys:tin-lead,with and without antimony,bismuth,cadmium,copper,and silver;tin-antimony;tin-bismuth;tin-copper,with and without silver and bismuth;tin-silver,with and without copper and bismuth;tin-zinc,with and without bismuth.It also includes an indication of the forms generally available.
EN ISO 9453:2006 history
2020EN ISO 9453:2020 Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
2014EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms
2006EN ISO 9453:2006 Soft solder alloys - Chemical compositions and forms ISO 9453:2006; Supersedes EN 29453:1993