JIS C 6485:2008 PDF

Scope: This Standard specifies the requirements for properties of paper based phenolic resin copper-clad laminates of both economic and high electrical grades, in thicknesses of 0.8 mm up to 3.2 mm. NOTE 1 This Standard gives the specification concerning the characteristics of the copper-clad laminates, the requirements of which present the values the products are expected to have. This Standard, therefore, is not intended to be used to conduct a conformity assessment by itself. NOTE 2 The International Standards corresponding to this Standard and the sym- bol of degree of correspondence are as follows. IEC 61249-2-1 : 2005 Materials for printed boards and other interconnect- ing structures Part 2-1: Reinforced base materials, clad and unclad-- Phenolic cellulose paper reinforced laminated sheets; economic grade, copper clad IEC 61249-2-2 : 2005 Materials for printed boards and other interconnect- ing structures Part 2-2: Reinforced base materials, clad and unclad-- Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad (Overall evaluation: MOD) The symbols which denote the degree of correspondence in the contents in the corresponding International Standard and JIS are IDT (identical), MOD (modified) and NEQ (not equivalent) according to ISO/IEC Guide 21.

JIS C 6485:2008 Referenced Document

IEC 60194 Printed board design, manufacture and assembly - Terms and definitions*， 2015-04-01 Update
IEC 61189-2 Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
JIS C 6481 Test methods of copper-clad laminates for printed wiring boards
JIS C 6515 Copper foil for printed wiring boards

2008 JIS C 6485:2008 Base materials for printed circuits -- Paper base, phenolic resin
1997 JIS C 6485:1997 Copper-clad laminates for printed wiring boards -- Paper base, phenolic resin