ASTM F1761-00
Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets

Standard No.
ASTM F1761-00
Release Date
2000
Published By
American Society for Testing and Materials (ASTM)
Status
Replace By
ASTM F1761-00(2005)
Latest
ASTM F1761-00(2011)
Scope

1.1 This specification covers measuring the DC magnetic field transmitted through a ferromagnetic sputtering target ("pass through flux" or "PTF").

1.2 Planar disk-shaped targets in the diameter range 5 to 8 in. inclusive (125 to 205 mm inclusive) and of thickness 0.1 to 0.5 in. inclusive (2.5 to 13 mm) may be characterized by this procedure.

1.3 This test method is also applicable to targets having an open center, for example, to targets 5-in. outside diameter by 2.5-in. inside diameter bu 0.25-in. thick (127-mm outside diameter by 63.5-mm inside diameter by 6.35-mm thick).

1.4 Targets of various diameters and thicknesses are accommodated by suitable fixturing to align the pieve under test with the source magnet mounted in the test fixture. Tooling, covering several popular target designs is specified in this procedure. Additional target configurations may be tested by providing special tooling. When special fixturing is used all parties concerned with the testing must agree to the test setup.

1.5 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

ASTM F1761-00 history

  • 2000 ASTM F1761-00(2011) Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets
  • 2000 ASTM F1761-00(2005) Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets
  • 2000 ASTM F1761-00 Standard Test Method for Pass Through Flux of Circular Magnetic Sputtering Targets



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