This test determines the compressive creep under laboratory conditions or under conditions that may be encountered during manufacture of electrical equipment. It has special significance if the material to be tested is applied as commutator segment insulation. It serves as a measure under specified conditions of the ability of the material to resist deformation while under compressive load, during exposure to elevated temperature for a specified time. This test is suitable for acceptance tests and for manufacturing control.
1.1 These test methods cover the testing of bonded mica splittings and bonded mica paper to be used for commutator insulation, hot molding, heater plates, and other similar insulating purposes.
1.2 These test methods appear in the following sections:
| Test | Sections |
| Compressive Creep | 4-10 |
| Dielectric Strength | 38-41 |
| Mica or Binder Content | 19 |
| Molding Test | 31-36 |
| Organic Binder | 20-24 |
| Resistivity | 42-46 |
| Silicone Binder | 25-.30 |
| Stability Under Heat and Pressure | 11-18 |
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 40.1 and 45.1 for specific hazard statements.
1.4 The values stated in inch-pound units are to be regarded as the standard.
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