IEC 60191-6-10:2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Dimensions of P-VSON

Standard No.
IEC 60191-6-10:2003
Release Date
2003
Published By
International Electrotechnical Commission (IEC)
Latest
IEC 60191-6-10:2003
Replace
IEC 47D/551/FDIS:2003
Scope
Provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (P-VSON).

IEC 60191-6-10:2003 history

  • 2003 IEC 60191-6-10:2003 Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Dimensions of P-VSON
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Dimensions of P-VSON



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