DIN EN 60191-6-4:2004
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003)
- Standard No.
- DIN EN 60191-6-4:2004
- Release Date
- 2004
- Published By
- German Institute for Standardization
- Latest
- DIN EN 60191-6-4:2004
- Replace
- DIN EN 60191-6-4:2002
- Scope
- This part of DIN EN 60191 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
DIN EN 60191-6-4:2004 history
- 2004 DIN EN 60191-6-4:2004 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003)
- 0000 DIN EN 60191-6-4:2002
