This Korean Industrial Standard specifies the copper-clad laminates for printed wiring boards (hereafter referred to as "copper-clad laminates" )using paper base, phenolic resin.
Remark Normative references to this standard shall be as follows.
KS C 6065 Glossary of Terms Relating to Printed Wiring Board
KS C 6480 General Rules of Copper-clad Laminates for Printed wiring Boards
KS C 6481 Test Methods of Copper-clad Laminates for Printed Wiring Boards
IEC 249-1-1(1985) Base materials for printed circuits. Patr 2 : Specifications
Specification No. a '■ Phenolic cellulose paper copper-clad laminates sheet, high electrical quality
IEC 249-2-2(1985) Base materials for printed circuits. Part 2 : Specifications
Specification No. 2 : Phenolic cellulose paper copper-clad laminates sheet, electrical quality
IEC 249-2-6(1985) Base materials for printed circuits. Patr 2 : Specifications
Specification No. 6 : Phenolic cellulose paper copper-clad laminates sheet of defined flammability (horizontal burning test)
IEC 249-2-7(1987) Base materials for printed circuits. Patr 2 : Specifications
Specification No. 7 : Phenolic cellulose paper copper-clad laminates sheet of defined flammability (horizontal burning test)
IEC 249-1-1(1985) Base materials for printed circuits. Patr 2 : Specifications
Specification No. 14 : Phenolic cellulose paper copper-clad laminates sheet of defined flammability (vertical burning test), economic quality
KS C 6482-1996 history
2006KS C 6482-2006 COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS - PAPER BASE, PHENOLIC RESIN
0000 KS C 6482-1996(2001)
1996KS C 6482-1996 COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS - PAPER BASE, PHENOLIC RESIN
1986KS C 6482-1986 COPPER-CLAD LAMINATES FOR PRINTED WIRING BOARDS - PAPER BASE, PHENOLIC RESIN