JIS Z 3198-6:2003
Test methods for lead-free solders -- Part 6: Methods for 45°pull test of solder joints on QFP lead

Standard No.

JIS Z 3198-6:2003

Release Date

2003

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS Z 3198-6:2003

Scope

This standard specifies the 45-degree pull test method for QFP lead joints using lead-free solder, which are mainly used for wiring connections and component connections in electrical equipment, electronic equipment, communication equipment, etc.

JIS Z 3198-6:2003 history

• 2003 JIS Z 3198-6:2003 Test methods for lead-free solders -- Part 6: Methods for 45°pull test of solder joints on QFP lead